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Changes for ARM/Qualcomm
- #585
#585
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spandruvada
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intel/thermal_daemon:master
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thermald_next
intel/thermal_daemon:thermald_next
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Jul 15, 2026
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Changes for ARM/Qualcomm
#585
spandruvada
merged 2 commits into
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intel/thermal_daemon:master
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thermald_next
intel/thermal_daemon:thermald_next
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Commits on Jul 15, 2026
Add Qualcomm SPEL cooling device support
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Add SoC model matching via device tree for ARM/Qualcomm platforms
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