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Merged
spandruvada merged 2 commits into from
Jul 15, 2026
Merged

Changes for ARM/Qualcomm #585

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fb130ee
Add Qualcomm SPEL cooling device support
priyjain1 Jun 29, 2026
a58b996
Add SoC model matching via device tree for ARM/Qualcomm platforms
priyjain1 Jul 2, 2026
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4 changes: 3 additions & 1 deletion Android.mk
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Original file line number Diff line number Diff line change
Expand Up @@ -49,7 +49,9 @@ LOCAL_SRC_FILES := \
src/thd_platform_arm.cpp \
src/thd_util.cpp \
src/thd_cdev_rapl_restore.cpp \
src/thd_features_parse.cpp
src/thd_features_parse.cpp \
src/thd_cdev_spel.cpp \
src/thd_cdev_spel_restore.cpp

LOCAL_C_INCLUDES += external/libxml2/include

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2 changes: 2 additions & 0 deletions Makefile.am
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Expand Up @@ -69,6 +69,8 @@ thermald_SOURCES = \
src/thd_rapl_power_meter.cpp \
src/thd_trt_art_reader.cpp \
src/thd_cdev_rapl_dram.cpp \
src/thd_cdev_spel.cpp \
src/thd_cdev_spel_restore.cpp \
src/thd_cdev_backlight.cpp \
src/thd_int3400.cpp \
src/thd_sensor_rapl_power.cpp \
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37 changes: 36 additions & 1 deletion data/thermal-conf.xml
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Expand Up @@ -6,6 +6,7 @@ use "man thermal-conf.xml" for details

<!-- BEGIN -->
<ThermalConfiguration>

<Platform>
<Name>Generic X86 Laptop Device</Name>
<ProductName>EXAMPLE_SYSTEM</ProductName>
Expand Down Expand Up @@ -203,6 +204,40 @@ use "man thermal-conf.xml" for details
</CoolingDevice>
</CoolingDevices>
</Platform>
<!-- Thermal configuration example for Qualcomm platforms using SoCModel.
SoCModel is matched as a prefix against /sys/firmware/devicetree/base/model.
e.g. "Qualcomm Technologies, Inc. Glymur CRD" will match
SoCModel "Qualcomm Technologies, Inc. Glymur"
-->
<Platform>
<Name>Qualcomm Glymur CRD Platform</Name>
<SoCModel>Qualcomm Technologies, Inc. Glymur CRD</SoCModel>
<Preference>QUIET</Preference>
<ThermalSensors>
<ThermalSensor>
<Type>cpu-thermal</Type>
<AsyncCapable>1</AsyncCapable>
</ThermalSensor>
</ThermalSensors>
<ThermalZones>
<ThermalZone>
<Type>cpu-thermal</Type>
<TripPoints>
<TripPoint>
<SensorType>cpu-thermal</SensorType>
<Temperature>85000</Temperature>
<type>passive</type>
<ControlType>SEQUENTIAL</ControlType>
<CoolingDevice>
<index>1</index>
<type>cpufreq</type>
<influence>100</influence>
<SamplingPeriod>10</SamplingPeriod>
</CoolingDevice>
</TripPoint>
</TripPoints>
</ThermalZone>
</ThermalZones>
</Platform>
</ThermalConfiguration>
<!-- END -->

8 changes: 8 additions & 0 deletions man/thermal-conf.xml.5
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Expand Up @@ -123,6 +123,14 @@ current virtual temperature.
set of tags defined to define platform, sensors, zones, cooling
devices and trip points. -->
<ProductName>Example Product Name</ProductName>
<!-- SoCModel is optional. When present, thermald reads the board
model string from /sys/firmware/devicetree/base/model and
checks whether it starts with this value (prefix match).
This is intended for ARM/device-tree platforms such as
Qualcomm SoCs. Example: a SoCModel of
"Qualcomm Technologies, Inc. Glymur" will match a board
reporting "Qualcomm Technologies, Inc. Glymur CRD". -->
<SoCModel>Example SoC Model Prefix</SoCModel>
<Preference>QUIET|PERFORMANCE</Preference>
<!-- Quiet mode will only use passive cooling device. "PERFORMANCE"
will only select active devices. -->
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